Ceramics (Aluminum nitride powder)

Aluminum nitride ceramic powder (AlN) is a high-performance ceramic material with high thermal conductivity, insulation, and low thermal expansion coefficient, widely used in fields such as electronic packaging and semiconductor heat dissipation. The following is its key information:

1. Basic characteristics Crystal structure: hexagonal wurtzite type, with a chemical composition of 65.81% aluminum and 34.19% nitrogen. Performance parameters: thermal conductivity of 170-320W/(m · K), thermal expansion coefficient matched with silicon, high temperature resistance up to 2200 ℃.

2. Preparation process Mainstream methods include carbon thermal reduction (accounting for 70% of the market), direct nitridation of aluminum powder, chemical vapor deposition, etc. Technical difficulties: The purity of the powder (required to be above 99.9%) and the particle size distribution (0.6-1.2 μ m) directly affect the performance of the sintered ceramic.

3. Application Fields Electronic devices: semiconductor packaging substrates, 5G RF devices, high-power LED substrates, etc. Industrial expansion: cutting-edge fields such as aerospace thermal management and neutron absorbing materials for nuclear reactors.